| 摘要 |
PURPOSE:To provide a device capable of accurately and easily positioning a frame with respect to bonding position by providing a means for detecting the incoming of a frame in a predetermined position close to a bonding position and setting as a reference position the position of a frame when the detected signal is obtained. CONSTITUTION:Plural sheets of frames L/F each of which is installed with semiconductor components 178 and stored into a frame storing means M are sequentially taken out to apply bonding thereto, and then the frames to which bonding has been applied are stored into the frame storing means M. In the frame positioning device of such a bonder, a detection means 187 for detecting the incoming of a frame is provided in a predetermined position close to a bonding position. After the frame L/F taken out from the storing means M is passed through a detecting position, it is moved to the original storing means M, and when the signal from the detection means 187 is obtained, the position of the frame L/F is set as a reference position. |
