| 摘要 |
PURPOSE:To obtain a semiconductor device where a bonding wire arranged between a semiconductor chip and a lead to be connected is surely prevented from short-circuiting to another lead intersecting under a loop, and a lead frame of the semiconductor device. CONSTITUTION:In a semiconductor device wherein a semiconductor chip 2 mounted on a die pad 1a of a lead frame 1 is wire-bonded to leads 1b, 1c, and some bonding wires 3 are bonded to leads to be connected across the other leads, an insulating coating 5 as a means for preventing electric short-circuit is formed at a crossing part with a wire for the other lead intersecting under the loop of a bonding wire. Further a halfway part intersecting the other lead above the wire loop is coated with adhesive agent 6, and fixed on the insulating coating on the lead side. |
