| 摘要 |
PURPOSE:To provide a machine for forming a small bump on the pad of a chip easily at low cost. CONSTITUTION:A sheet 14 embedded with multiple conductive pieces 15 is held horizontally and a chip 6 is disposed below the sheet 14. A presser 26 held on a horn 25 is disposed above the sheet 14 and then the presser 26 is lowered to press the conductive pieces against the pads 7 on the chip 6 thus bonding the conductive pieces thereto. This machine allows easy formation of a small bump on the pad 7 and since the bump can be formed using a machine similar to a wire bonder, facility cost is reduced resulting in low cost formation of a bump. |
