Method of fabricating an electronic interconnection

摘要

Disclosed is a method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method including the steps of: (a) applying a quantity of solder to the solder column or I/O pad; (b) aligning the solder column with the I/O pad such that there is a quantity of solder between them; (c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and (d) planarizing the solder column to a predetermined height. Also disclosed is the electronic interconnection structure made by the method according to the invention.