| 摘要 |
PURPOSE:To enhance reliability in through hole connection of a multilayer wiring board. CONSTITUTION:A Ti film 3 and an Au film 4 are formed on an epoxy resin film 2 formed on an alumina ceramic board 1 and then a circuit is patterned thereon. Furthermore, a silicon oxide film 5 is formed and a through hole having opening dimesion of X1XY1 is made by lithography technology. In this regard, the dimension X1-Y1 is set larger than the pattern dimension of the Au film 4. |
