| 摘要 |
PURPOSE:To perform suitable resin molding for products to be molded which is hard to mold with resin, such as TAB tape, and obtain products of excellent quality. CONSTITUTION:This resin molding device is a device for clamping products 10 to be molded, such as TAB tape or lead frame, with a molding die 14a, 14b to perform resin molding. A gate 32 for filling resin into a cavity 16a, 16b is opened in the inner bottoms surface of the molding die 14a, 14b. A pot 30 and the cavity 16a, 16b are connected with the gate 32 to perform resin filling with a plunger 34. |
