| 摘要 |
PURPOSE:To ease an impact load to the chip parts such as a semiconductor chip so as to prevent poor quality. CONSTITUTION:A collet attracting a die is driven by a linear motor 12. For instance, at the time of performing die bonding, a control part 31 controls the linear motor 12 so as to place a die attracted by the collet on the bonding part of a lead frame. In this state, the control part 31 gradually increase torque supplied to the linear motor 12 so as to gradually press the die. Accordingly, an impact load to the die can be eased so as to prevent generation of a defect such as a crack. |
