发明名称 SEMICONDUCTOR MOLDING APPARATUS PROVIDED WITH INCLINED GATE
摘要 <p>PURPOSE: To obtain a device for executing a highly reliable mold process by making proper the flowing state of mold materials packed in a cavity by allowing a gate for connecting a cavity with a runner to have an inclined part, having a prescribed inclination angle at a cavity entrance part. CONSTITUTION: This device is provided with a cavity 40, formed of the clamps of an upper mold 45 and a lower mold 46, a runner in which mold materials are allowed to flow, and a gate 47a for connecting the cavity 40 with the runner. In this mold device for manufacturing a semiconductor, the gate 47a is allowed to have an inclined part 48a having a prescribed inclination angleθat the entrance part of the cavity 40. For example, the prescribed inclination angleθof the inclined part 48a is allowed to have a value larger than 20 deg. but smaller than 35 deg.. Thus, the packed state of the mold materials flowing in the cavity can be adjusted to be uniform, and the reliability of the mold process can be improved.</p>
申请公布号 JPH06177189(A) 申请公布日期 1994.06.24
申请号 JP19910171924 申请日期 1991.06.18
申请人 SAMSUNG ELECTRON CO LTD 发明人 WANNKIYUN CHIYOI;KIIIEON JIEON;IEONNTAE KIMU
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/27;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
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