发明名称 CONDUCTOR FRAME PROVIDED WITH SLOT AND METHOD FOR MOLDING OF INTEGRATED-CIRCUIT PACKAGE
摘要 PURPOSE: To evacuate air, other gas or to extrude excessive resin inside a mold cavity by providing a conductor frame provided with a ventilation hole or a slot inside the conductor frame. CONSTITUTION: The slot or an opening part 40 is provided on the end part provided with a supporting bar 28 of the conductor frame 10. Thus, the slot 40 functions as a flow gate for controlling the flow of resin or molding compound to the mold cavity 66. Also, the slot or the opening part 50 is provided on the conductor frame 10 oppositely to the slot 40. The slot 50 functions as the ventilation hole for permitting the evacuation from the mold cavity 66 of the air and the other gas. Thus, the mold cavity is efficiently used by the integrated circuit of various sizes (thicknesses) and the service life of a mold is improved while reducing the requirements of maintenance.
申请公布号 JPH06177305(A) 申请公布日期 1994.06.24
申请号 JP19930211431 申请日期 1993.08.26
申请人 TEXAS INSTR INC <TI> 发明人 MIN WAI CHIYAN
分类号 H01L21/56;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L21/56
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