FABRICATION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a method for fabricating a semiconductor device having a plastic package in which productivity is enhanced while improving vidual confirmation of the marking. CONSTITUTION:Holding pins 17 are provided for metal molds 16a, 16b and resin molding is carried out while holding a heat sink 12 on the holding pins 17 on the side where a semiconductor chip 11 is not mounted. Consequently, a resin film 14a is formed on the plane of the heat sink 12 where the semiconductor chip 11 is not mounted and the resin film 14a is eventually removed by means of a laser beam L thus marking a pattern.