| 摘要 |
<p>PURPOSE:To shorten time for adhering the frame of a memory card with a panel. CONSTITUTION:After the process of thermocompression bonding a panel 7 to the frame 5 of a memory card 1, air for cooling is injected into the memory card 1, air inside the memory card 1 is cooled, and an adhesive 8 such as a heat sensitive adhesive or a pressure sensitive adhesive inside the memory card 1 is directly cooled from the inside of the memory card 1.</p> |
