| 摘要 |
PURPOSE:To provide suitable resin molding products for a TAB tape by preventing short-circuiting due to melted solder between leads and the like and also preventing an organic material used for a TAB tape from being mixed into resin. CONSTITUTION:A TAB 11 is clamped with molding dies 16, 18, and molten resin is transferred under pressure into a cavity by a plunger 26. The die temperature of the molding dies 16, 18 is set at a temperature not higher than the temperature at which the solder plating of covering the conductor pattern of the TAB tape is melted and not lower than the glass-transition temperature of the resin used for molding to perform resin molding. |
