发明名称 SOLDER FEEDING SHEET
摘要 PURPOSE:To provide a means with which a defective electronic part can be resoldered to a printed substrate in a simple manner. CONSTITUTION:A solder film 8 is formed on the position corresponding to the land 6 of the printed substrate 4 of the sheet 7 which is formed by the material having the property which activates the solder same as a flux, and it is used as the solder feeding sheet 7 of an electronic part 1. As a result, even when the electronic part 1 has a narrow pitch lead 3, it can be resoldered easily.
申请公布号 JPH06177524(A) 申请公布日期 1994.06.24
申请号 JP19920325267 申请日期 1992.12.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAMI SEIJI
分类号 H05K3/34 主分类号 H05K3/34
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