| 摘要 |
<p>An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die ( 112) is attached to a thermally conductive, electrically-insulated substrate (114) having a central region. A lead frame has inwardly extending bonding fingers (116), which are attached to the outer margins of the thermally conductive, electrically-insulated substrate (114). Apertures (104, 106, 108, 110) are formed through the substrate (114) adjacent to the outer margins of the substrate at locations which are between the integrated-circuit die (112) and the ends of the bonding fingers (116). The apertures (104, 106, 108, 110) provide a path for the plastic material to flow over the substrate (114) so that the flow of plastic material is balanced over the top and bottom of the substrate to provide the molded package body substantially free of voids. The apertures (104, 106, 108, 110) are formed in the substrate (114) as elongated slots.</p> |
