发明名称 |
Verfahren zum Fügen und Schweißen von Teilen durch Ultraschall sowie Halbzeug zur Verwendung bei diesen Verfahren |
摘要 |
<p>(A) in the ultrasonic bonding and/or welding of pts., at least one of the pts. is a large surface area semi-finished product comprising several pts. in strip and/or interlinked form, the individual pts. being isolated by the ultrasound during bonding and/or welding. (B) Also claimed are (a) a semi-finished prod. of solder foil for use in the process, the solder foil comprising strips (10,20) of predetermined width (B) and lines of weakness of spacing (A); and (b) a semi-finished plastics prod. for use in the process, comprising a strip of interlinked plastics parts with lines of weakness. USE/ADDVANTAGE - The process is useful for welding solder foils to contact pieces in switchgear and for joining injection moulded plastics pts.. It facilitates precise handling and positioning of the pts..</p> |
申请公布号 |
DE4024941(C2) |
申请公布日期 |
1994.06.23 |
申请号 |
DE19904024941 |
申请日期 |
1990.08.06 |
申请人 |
SIEMENS AG, 80333 MUENCHEN |
发明人 |
MOLL, HELMUT, DIPL.-ING., 8520 ERLANGEN;KRAUSE, RALF-DIETER, DIPL.-ING., 8500 NUERNBERG |
分类号 |
B23K20/10;B23K35/14;B29C65/06;B29C65/08;(IPC1-7):B23K20/10 |
主分类号 |
B23K20/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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