发明名称 Verfahren zum Fügen und Schweißen von Teilen durch Ultraschall sowie Halbzeug zur Verwendung bei diesen Verfahren
摘要 <p>(A) in the ultrasonic bonding and/or welding of pts., at least one of the pts. is a large surface area semi-finished product comprising several pts. in strip and/or interlinked form, the individual pts. being isolated by the ultrasound during bonding and/or welding. (B) Also claimed are (a) a semi-finished prod. of solder foil for use in the process, the solder foil comprising strips (10,20) of predetermined width (B) and lines of weakness of spacing (A); and (b) a semi-finished plastics prod. for use in the process, comprising a strip of interlinked plastics parts with lines of weakness. USE/ADDVANTAGE - The process is useful for welding solder foils to contact pieces in switchgear and for joining injection moulded plastics pts.. It facilitates precise handling and positioning of the pts..</p>
申请公布号 DE4024941(C2) 申请公布日期 1994.06.23
申请号 DE19904024941 申请日期 1990.08.06
申请人 SIEMENS AG, 80333 MUENCHEN 发明人 MOLL, HELMUT, DIPL.-ING., 8520 ERLANGEN;KRAUSE, RALF-DIETER, DIPL.-ING., 8500 NUERNBERG
分类号 B23K20/10;B23K35/14;B29C65/06;B29C65/08;(IPC1-7):B23K20/10 主分类号 B23K20/10
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