Soldering process with exhaust gas cleaning

摘要

The process concerns soldering of components (in particular, circuit boards) in closed installations, for example, by wave or reflow methods. The mixt. of process gas and harmful substances generated in the soldering process is collected and subjected to condensation.Condensation of the harmful substances of the exhaust gas from the soldering process takes place at a temp. of 5 deg.C and below, pref. at a temp. between -10 and -40 deg.C (of the exhaust gas leaving the condenser). Cryogenic liquid gases (in particular, liquid nitrogen) which in gaseous state are usable as a process gas or as a constituent of a process can be used as source for low temps.