Appts. for desoldering soldered-on electric components

摘要

The appts. for releasing soldered-on electric components (2) from a circuit board (1) incorporates a shaped, nozzle-like unit (11) for directing a heated gaseous medium (21) to the soldered joint.The medium (21) consists of an evaporated liquid (20) whose boiling point is above the melting point of the solder material, and which is delivered from a vapour generator (4) into the unit (11) via a pipe (5). The unit (11) is transportable, and can be placed and supported on the circuit board (1) so that it envelopes the component (2) together with its soldered joints.The unit is provided with an internal suction opening connected with a pipe (6) leading back into the vapour generator (4).