| 摘要 |
Photosensitive compositions The invention relates to photosensitive compositions comprising A) from 40 to 80 % by weight of at least one liquid epoxy resin having an epoxy function-ality of equal to or greater than 2, B) from 0.1 to 10 % by weight of at least one cationic photoinitiator for component A), C) from 5 to 40 % by weight of at least one liquid cycloaliphatic or aromatic diacrylate, D) from 0 to 15 % by weight of at least one liquid poly(meth-)acrylate having a (meth-)-acrylate functionality of greater than 2, the proportion of component D) constituting a maximum of 50 % by weight of the total (meth-)acrylate content, E) from 0.1 to 10 % by weight of at least one radical photoinitiator for component C) and, where appropriate, D) and F) from 5 to 40 % by weight of at least one OH-terminated polyether, polyester or polyurethane, which are especially suitable, for example, for the manufacture of photopolymerised layers, especially of three-dimensional objects.
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