发明名称 Packaging of electronic devices
摘要 PCT No. PCT/GB91/01458 Sec. 371 Date May 14, 1992 Sec. 102(e) Date May 14, 1992 PCT Filed Aug. 28, 1991 PCT Pub. No. WO92/03845 PCT Pub. Date Mar. 5, 1992.An electronic device (10) encased within a moulded package body (11) has a leadframe (12) extending therefrom. In order to protect the leads (16) for the electronic device a guard ring (14) is provided on the leadframe. By making the guard ring independently of the moulded package body and fitting it separately to the leadframe one can deal with packages of any size in a simple manner and irrespective of the material of the package body (11).
申请公布号 GB2255953(B) 申请公布日期 1994.06.22
申请号 GB19920008683 申请日期 1992.04.22
申请人 * LSI LOGIC EUROPE PLC 发明人 TREVOR CLIFFORD * GAINEY
分类号 H01L23/50;H01L21/00;H01L23/495;(IPC1-7):H01L23/00;B65D81/02 主分类号 H01L23/50
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