发明名称 Applying conductive lines to integrated circuits
摘要 A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
申请公布号 US5321886(A) 申请公布日期 1994.06.21
申请号 US19930068037 申请日期 1993.05.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHALCO, PEDRO A.;CALI, MATTHEW F.;ECONOMIKOS, LAERTIS;SPEIDELL, JAMES L.
分类号 H01L23/12;G02F1/13;H01L21/768;H05K3/00;H05K3/02;H05K3/20;H05K3/22;H05K3/28;H05K3/46;(IPC1-7):H05K3/02 主分类号 H01L23/12
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