发明名称 |
HARD BRITTLE THIN PLATE POLISHING METHOD |
摘要 |
PURPOSE:To provide a polishing method wherein productivity and processing precision are high by controlling the working condition on the basis of such data that the polishing resistance and the temperature of abrasive grains are significant elements in the relationship between the external condition for affecting the abrasive grains and the polishing speed. CONSTITUTION:A load detector 11 of polishing resistance and a temperature detector 12 of abrasive grains are arranged in a polishing machine 10. The supply amount of the abrasive grains is determined on the basis of the detected data of both detectors, and the hard brittle thin plate is polished while the polishing speed is controlled. |
申请公布号 |
JPH06170728(A) |
申请公布日期 |
1994.06.21 |
申请号 |
JP19920320895 |
申请日期 |
1992.11.30 |
申请人 |
NAOETSU SEIMITSU KAKO KK |
发明人 |
IWAKATA SEIICHI;WATANABE YOSHINORI |
分类号 |
B24B37/015;B24B49/14;B24B49/16;B24B57/02;H01L21/304 |
主分类号 |
B24B37/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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