发明名称 LASER REFLOW SOLDERING DEVICE ASSISTED BY GAS FLUX AND SOLDERING METHOD
摘要 PURPOSE: To suppress the generation a residue at the time of soldering and to eliminate the need for a costly device and laborious work for removal of the residue by assisting reflow soldering by a laser using a gaseous flux under an atmospheric pressure. CONSTITUTION: The gaseous flux is assisted for the laser reflow soldering device 10 consisting of a plenum chamber 12, a gaseous flux inlet line 16 which is coupled to the plenum chamber 12 and transports the gaseous flux, an outlet nozzle 34 which has an axis and is connected from the plenum chamber 12, a laser beam 28 light source which has an axis coaxial with the axis of this outlet nozzle 34 and a focusing lens 22 which is arranged on the axis of the laser beam source and aligns the focus of the laser beam 28 to the material be soldered. The need for carrying out cleaning after soldering by using a detergent detrimental to the environment is eliminated and the fine control is possible.
申请公布号 JPH06170521(A) 申请公布日期 1994.06.21
申请号 JP19920167632 申请日期 1992.06.25
申请人 DIGITAL EQUIP CORP <DEC> 发明人 GEARII EMU FURIIDOMAN
分类号 B23K1/005;B23K1/20;B23K26/14;B23K31/02;H05K3/34 主分类号 B23K1/005
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