发明名称 Method of processing photosensitive glass with sections of differing exposure energies and article
摘要 A photosensitive glass processing method, and article made thereby, which makes it possible to facilitate the etch depth control, minimize the surface roughness of the etched surface, improve the operating efficiency in single-side etching process, and increase the yield includes a first exposure step, in which laser light is applied to the obverse side of photosensitive glass from above it through an exposure mask by using a pulsed laser that covers the sensitivity wavelength range of the photosensitive glass, thereby forming a first exposed portion, the energy intensity per pulse of laser light being set at 10 mJ/cm2, and the total exposure energy being set at 500 mJ/cm2; a second exposure step, in which laser light is applied to an end surface of the photosensitive glass through another exposure mask, thereby forming a second exposed portion, the energy intensity per pulse of laser light being set at 10 mJ/cm2, and the total exposure energy being set at 15,000 mJ/cm2, wherein the first exposed portion, which is crystallized by heat treatment, is easy to etch, while the second exposed portion, which is crystallized by the same heat treatment, is difficult to etch, and a groove is formed at the position of the first exposed portion.
申请公布号 US5322538(A) 申请公布日期 1994.06.21
申请号 US19920975246 申请日期 1992.11.12
申请人 SEIKOSHA CO., LTD. 发明人 KONDO, NOBUHIRO;ONO, HIROKAZU
分类号 B41J2/16;B81C99/00;C03C4/04;C03C15/00;(IPC1-7):C03B32/00;C03C10/00 主分类号 B41J2/16
代理机构 代理人
主权项
地址