发明名称 Test template for monitoring the pins of a multi-pin chip cirucit package
摘要 A module probe template comprises a substrate of electrically insulative material which possesses contact pads or lands which at least partially surround substrate apertures which match the pin pattern on a module to be tested. Pin shoulders make contact with the land portions in the vicinity of the apertures and a second portion of the conductive land pattern extends to the edge of the template so as to provide connections to wires which supply signals to test and/or control instrumentation. A layer of thin electrically insulative tape or other material is also preferably laid over the conductive paths with small apertures present in the insulative tape so as to provide (in one embodiment) access to the contact land near the pin holes. This test template apparatus thus makes it possible to control and/or monitor pins which are otherwise inaccessible except with much greater difficulty.
申请公布号 US5323105(A) 申请公布日期 1994.06.21
申请号 US19910742777 申请日期 1991.08.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DAVIS, JR., THOMAS L.;QUINN, TERRENCE A.
分类号 G01R1/04;G01R31/28;(IPC1-7):G01R31/02;H01R23/72 主分类号 G01R1/04
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