发明名称 Appts. for feeding solder wire in soldering installation - with wire deflection measured within its bending region resulting from an angle in the wire feed direction
摘要 The appts. for feeding solder wire to a heated component incorporates a controllable motor for continuous delivery of the wire, at least one wire guide unit, and a measuring device which controls the wire feed motion dependent on the actual melting process at the component. The motor (12) and/or the guide units (13A,13B) are arranged so that the feed direction of the motor feed rolls (12A,12B) and the feed direction at the component (14) form an angle (alpha) with one another, while the measuring device (16) determines the wire deflection (a) within its bending region. The device (16) measures the position (a) of a point (X) perpendicular to the solder wire (20). The point (X) is located at the middle of the bending region. The angle (alpha) lies within the range 10-40 deg. The motor speed is controlled by the deflection (a) with the limit values (a1) and (a2) used for its stopping and starting. USE/ADVANTAGE - In soldering installations. Only the changes in the resistance to the wire feed motion brought about exclusively by changing situations at the component are measured.
申请公布号 DE4312224(C1) 申请公布日期 1994.06.16
申请号 DE19934312224 申请日期 1993.04.14
申请人 SCHUESSLER-TECHNIK BERND SCHUESSLER MASCHINEN UND ELEKTRONIK, 75181 PFORZHEIM 发明人 SCHUESSLER, BERND, 75175 PFORZHEIM
分类号 B23K3/06;B23K9/133;B65H51/30;(IPC1-7):B23K3/06;B65H51/20 主分类号 B23K3/06
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