发明名称 Reed switch with 3D metallic microstructure
摘要 The switch (1) has a base (2) supporting two rods (19,21) each placed on a foot (15,17) and thus defining two electrodes (4,6). The base and rods are placed inside a sealed envelope.The switch is manufactured on a silicon wafer which is processed in a batch with other wafers and then cut out when the processing is finished. The base is covered by a silicon dioxide layer and presents two conducting areas (12,13).
申请公布号 FR2699323(A1) 申请公布日期 1994.06.17
申请号 FR19920015213 申请日期 1992.12.15
申请人 ASULAB SA 发明人 BORNAND ETIENNE;SIMON JEAN-LUC
分类号 H01H1/00;H01H1/66;(IPC1-7):H01H36/00;H01H11/06 主分类号 H01H1/00
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