| 发明名称 |
Integrated circuit chip composite. |
| 摘要 |
A composite containing an integrated circuit chip (1) having conductive site (3) thereon and electrically conductive leads (5) that are interconnected to the conductive site by electrically conductive wire (4); wherein the wire is coated with a dielectric material parylene (6). <IMAGE> |
| 申请公布号 |
EP0601323(A1) |
申请公布日期 |
1994.06.15 |
| 申请号 |
EP19930117486 |
申请日期 |
1993.10.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ZECHMAN, JOHN HAROLD |
| 分类号 |
H01L21/60;H01L23/29;H01L23/31;H01L23/49;H01L23/495;H01L23/552;H01L23/64 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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