| 摘要 |
<p>A photosensitive resin composition wherein the photosensitive group is readily available and easy to introduce, which has good storage stability, thermal stability, practical properties and sensitivity, and which does not undergo cracking in the development stage. The composition comprises 100 parts by weight of a polyimide, 10-100 parts by weight of a (meth)acrylated isocyanurate, 10-100 parts by weight of polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. It can provide a patterned, heat-resistant polyimide film. The film is suitable for uses related to electronic materials, for example, an interlaminar film of a multilayered plate of a printed wiring board.</p> |
