| 摘要 |
<p>A ceramic package used for a semiconductor device comprises a plate-shaped base made of a material consisting essentially of ceramic. In plan view, the base is rectangular and has four corner portions (C0) each located between two adjacent side walls. The corner portion (C0) comprises a main bevel (23) and two auxiliary bevels (241, 242) located at respective sides of the main bevel and extending to the two side walls (W1, W2), respectively, so that two first corners (C11,C12) are defined between the main bevel (23) and the auxiliary bevels, respectively, and two second corners (251, 252) are defined between the auxiliary bevels (241, 242) and the side walls (W1,W2) of the base, respectively.</p> |
