发明名称 Electronic device package mounting assembly
摘要 A unitary clip having a base portion and a stake end is used to attach an electronic device package to a heat sink. The stake end of the clip is secured within an aperture such as a groove or slot in the face of the heat sink and connected to the base by a curved spring portion. An electronic device package inserted between the base portion and the heat sink is urged into intimate contact with the surface of the heat sink.
申请公布号 GB2243026(B) 申请公布日期 1994.06.15
申请号 GB19910004535 申请日期 1991.03.04
申请人 * THERMALLOY INCORPORATED 发明人 DONALD L * BLAND;MATTHEW C * SMITHERS
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
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