| 摘要 |
PURPOSE:To improve the heat resistance and the reliability of a barrier layer for preventing the reaction of wiring and solder which are used in a flip chip. CONSTITUTION:A gold pad 4 of a barrier pad 3 and a wiring contact 2 are separately arranged with a lateral distance l. When the distance l is adjusted, heat resistance equivalent to the value which is obtained when the thickness of the barrier pad 3 as barrier metal is large can be obtained. Since contact positions are shifted, reliability is not deteriorated by pin holes which are generated at the time of barrier pad formation, and by flaws and cracks caused by electric probe check.
|
