| 摘要 |
Process for the hybridization and positioning of an optoelectronic component on a substrate and application of this process to the positioning of a laser diode with respect to an optical guide. This process consists of forming on the substrate at least one abutment (16), which determines by fitting in at least one notch (34) formed on the component to be hybridized, the lateral positioning of said component, forming shims (24) on the substrate (6), whose height fixes the vertical positioning of the component (2), the latter being provided with pads or studs (32) of a first material, forming studs or pads (26) of a second material on the substrate, forming on the pads of the second material a welding chip (28) made from a meltable material able to wet in the melted state the first and second materials and not the area round them, positioning the component in contact with the welding chip in such a way that the abutment (16) is fitted into the notch (34) and the welding chip (28) faces the pad not provided with a chip, raising the assembly to the melting point of the chips and bringing the assembly to a temperature below the melting point thereof.
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