| 摘要 |
<p>PURPOSE:To remove chip easily bonded to a semiconductor substrate holding plate, in a chemical bath. CONSTITUTION:Through holes 1a are bored at parts of a semiconductor substrate holding plate 1 corresponding to the bonded parts of chips 3. Accordingly, an adhesive 2 is easily dissolved by a chemical, and the chips are easily removed from the semiconductor substrate holding plate 1, since the solution in a chemical bath 6 touches the adhesive 2 through the through holes 1a.</p> |
