| 摘要 |
PURPOSE:To lessen a printed wiring board in manufacturing cost by a method wherein a soldering operation is easily carried out onto the printed wiring board. CONSTITUTION:A printed wiring board is formed through such a manner that a copper foil is formed on a board and worked into a required printed wiring circuit by etching. That is, a copper foil 2 is laminated on the surface of a board 1 to form a copper plated laminated board 3, a solder foil 4 is laminated on all the surface of the copper foil 2, etching resist is applied onto the surface of the solder foil 4, the solder foil 4 and the copper foil 2 are etched at the same time for the formation of a conductor pattern 8, and then the etching resist is separated off. The unnecessary part of the solder foil 4 out of the conductor pattern 8 is removed, whereby a printed wiring board is formed. |
