| 摘要 |
PURPOSE:To provide a lead frame, which is intended for realizing a surface mounting type high-speed LSI package that is light and can be provided at a low cost, can provide the fine pitch of inner leads, can cope with multiple pins and has the excellent heat dissipation property, low power-supply noise characteristics and wire bonding characteristics, and to provide the manufacturing method of the lead frame and the semiconductor package using this lead frame. CONSTITUTION:The layers having the following constitutions are sequentially laminated, and a unitary body is formed. A grounding layer 1 has a plurality of protruding parts 2 for leads at the peripheral part. A heat resisting insulating epoxy resin layer 3 is provided. A square-frame shaped power supply part layer 7 is separated from each lead 5 and connected to power supply leads 6. The layer 7 is formed at the space part at the inside of the tips of the leads 5 in a lead frame layer 4. An insulating material layer 8 comprises a thin film of heat-resisting insulating epoxy resin or ceramic, which is formed at the required part other than the central part of the square- frame shaped power supply part layer. A signal wiring layer 9 comprises an Al thin film wiring or a Cu thin film wiring. |
