发明名称 Method of forming a pattern from a photosensitive heat-resistant poly(amide)imide having hydroxyphenyl groups
摘要 A photosensitive polymer containing a repeating unit represented by the following formula (I) and having a logarithmic viscosity number of from 0.1 to 5 dl/g as measured in a solvent at a temperature of 30+/-0.01 DEG C. at a concentration of 0.5 g/dl: <IMAGE> (I) (wherein R1 is a trivalent or tetravalent carbocyclic aromatic group or heterocyclic group, R2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group, R3 is a divalent organic group, R4 is <IMAGE> a hydrogen atom or a monovalent organic group, R5 is a hydrogen atom or a monovalent organic group, m is independently 1 or 2, n is independently 0 or 1, and m and n meet 1</=m+n</=2); a method for preparing the above-mentioned photosensitive polymer; a photosensitive polymer composition containing the above-mentioned photosensitive polymer; and a method for preparing a poly(amide)imide film.
申请公布号 US5320935(A) 申请公布日期 1994.06.14
申请号 US19930123243 申请日期 1993.09.20
申请人 CHISSO CORPORATION 发明人 MAEDA, HIROTOSHI;KUNIMUNE, KOUICHI
分类号 G03F7/008;C08G73/00;C08G73/10;C09D179/00;C09D179/08;C09K9/02;G03F7/038;(IPC1-7):G03F7/30;G03F7/012 主分类号 G03F7/008
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