| 摘要 |
<p>PURPOSE:To provide a sucking device capable sucking and exfoliating chips from a pressure sensitive adhesive sheet surely, without repeating an sucking miss in the case of resucking action after committing an sucking miss. CONSTITUTION:Concerning to a chip sucking device which sucks and exfoliates chips 2 bonded to a pressure sensitive adhesive sheet 1 beforehand from the pressure sensitive adhesive sheet 1, a constant time after thrusting-up by a thrusting-up pin 3 at the time of resucking action after an sucking miss is set longer than a constant time at the time of sucking action just before the sucking miss.</p> |
