| 摘要 |
PURPOSE: To produce a passage, namely, a conductive line for metal processing and circuit forming layers in the case of IC connection by forming a hole, namely a recess on a polymer insulating layer, namely, etching this layer and depositing a metal layer, namely, a film on this insulating layer later. CONSTITUTION: A substrate 50 is composed of polyimide or other electric insulating materials and by having a hole formed by etching, namely, by having configuration 52 on the substrate, either the passage or a groove to be ordinarily utilized for metal processing or circuit formation can be provided. Afterwards, the layer of metal materials 54 is applied onto an upper surface 56 of insulating substrate 50. When applying a laser pulse, metal is fused so as to sufficiently fill the passage, namely, a groove 52. The excessive section of metal materials 54 on the surface 56 of insulating substrate 50 is removed by fusing or evaporating at high temperature. Thus, the upper surface of insulating materials can be flattened through a single processing step. |
