| 摘要 |
<p>PURPOSE:To provide a method of manufacturing a printed wiring board which has such properties that it is able to turn solder-resistant as usual without any complicated technical operation, flux-repellent, and solder-antisticking. CONSTITUTION:A circuit pattern 2 is formed on the one side 1a of an insulating board 1, and solder resist ink which contains silicone resin and/or fluororesin besides its main component is applied to form a solder resist film 6 an the surface of the circuit pattern 2 for the formation of a printed wiring board.</p> |
