发明名称 PHOTOCURABLE LIQUID SOLDER RESIST INK COMPOSITION
摘要 <p>PURPOSE:To obtain the subject composition which can give a cured film excellent in resolution, heat resistance, adhesion, chemical resistance and tackfreeness by mixing a specified photopolymerizable resin with a photopolymerization initiator and a diluent. CONSTITUTION:The objective composition comprises a photopolymerizable resin which is prepared by introducing (meth)acryloyl groups into an at least tetranuclear novolac epoxy resin by reaction with (meth)acrylic acid and epoxy groups and increasing the molecular weight of the resin by extension through the epoxy groups and hydroxyl groups formed by the reaction of the epoxy groups with (meth)acrylic acid with a chain extender (e.g. hexamethylene diisocyanate) having at least two functional groups reactive with the epoxy groups and/or the hydroxyl groups, a photopolymerization initiator (e.g. Irgacure 907, a product of Ciba-Geigy AG) and a diluent (e.g. pentaerythritol tetraacrylate).</p>
申请公布号 JPH06166843(A) 申请公布日期 1994.06.14
申请号 JP19930222489 申请日期 1993.09.07
申请人 NIPPON SHOKUBAI CO LTD 发明人 AWAJI TOSHIO;TANAKA HIROMICHI
分类号 C08F299/02;C08F290/00;C08G18/67;C08G59/17;C09D11/033;C09D11/10;C09D11/101;C09D11/102;C09D11/106;G03F7/027;G03F7/028;H05K3/28;(IPC1-7):C09D11/10 主分类号 C08F299/02
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