| 摘要 |
<p>PURPOSE:To make the rotation center of chips and those of a thrusting-up pin and the attraction head of a pick-and-place unit coincide, and to facilitate the control of chip feeding to a bonding stage, by causing the thrusting-up pin and the suction head to have THETA drive mechanisms respectively. CONSTITUTION:A stage 10 in an expanding part 2 has X- and Y-direction drive mechanisms, and a thrusting-up pin which acts on chips from under a wafer has a THETA drive mechanism for correcting the angle of rotation of the pin. Besides, the suction head of a pick-and-place unit 3 has a THETA drive mechanism for correcting the angles of rotation of the chips. For example, a picture processing camera detects the angle of rotation of each chip, and adjusts the angle of the thrusting-up pin by controlling the THETA drive motor. In addition, the shear angle of the chip is corrected by the THETA drive of the suction head of the pick-and place unit 3, and the chip is delivered to a bonding stage 32.</p> |
