| 摘要 |
PURPOSE:To provide a semiconductor device having a structure wherein a semiconductor pellet is bonded to a heat dissipating plate via solder, and its manufacturing equipment and method. CONSTITUTION:A semiconductor pellet 3 is bonded to a heat-dissipating plate 1 via solder 4 containing magnetic fine particles 8. For manufacturing a semiconductor device, the following are arranged; a solder supply part 10 which supplies solder 4 containing magnetic fine particles 8 to a hot heat-dissipating plate 1, along a guide rail 9 which carries the heat-dissipating plate while heating it, a semiconductor pellet supply part 12 which supplies semiconductor pellets 3 to the fused solder 4 on the heat-dissipating plate 1, and a magnetism generating part 14 which applies a magnetic field to the fused solder 4 and exert moving force to the magnetic fine particles 8. When the solder 4 containing the magnetic fine particles 8 is supplied to the hot heat-dissipating plate 1, the semiconductor pellets 3 are supplied to the fused solder 4, and the solder 4 is bonded to the heat-dissipating plate 1, the magnetic field is applied to the magnetic fine particles 8 in the fused solder 4. |
