发明名称 THERMOCOMPRESSION BONDING METHOD FOR MEMORY CARD AND CONTACT BONDER
摘要 <p>PURPOSE:To thermocompression-bond a panel effectively with a frame at a low heating temperature and low pressing force. CONSTITUTION:When a panel 7 is thermocompression-bonded with a frame 5 through a thermocompression bonding means by using thermal adhesives, pressure-sensitive adhesives, etc., only a bonding clearance W to the frame 5 of the outer circumference, etc., of the panel 7 is thermocompression-bonded concentrically by projecting sections 12b, 13b formed to thermocompression bonding plates 12, 13.</p>
申请公布号 JPH06166286(A) 申请公布日期 1994.06.14
申请号 JP19920341080 申请日期 1992.11.30
申请人 SONY CORP 发明人 KIKUCHI SHUICHI
分类号 B42D15/10;G06K19/077;(IPC1-7):B42D15/10 主分类号 B42D15/10
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