| 摘要 |
<p>PURPOSE:To obtain a semiconductor manufacturing device capable of sucking wafers horizontally, without being influenced by the warp of the wafers or foreign matter on the rears. CONSTITUTION:Cylindrical pole struts 4 movable upwards and downwards are provided on a wafer stage 1. When a wafer 3 is carried in and put on a specified position of a wafer stage 1, wafer conditions such as warp etc., are confirmed by a sensor, and each cylindrical pole strut 4 is moved upwards and downwards in accordance with the conditions. Even when there is a foreign matter 5 on the rear of the wafer 3, the wafer sucking surface is similarly set adjusting it to the height of the foreign matter 5. Accordingly, it becomes possible to such the wafer 3 horizontally, with an effect that it becomes possible to stabilize the process, and obtain a high reproducibility.</p> |
