| 摘要 |
A seal assembly for a vacuum molding apparatus having a pair of dies movable with respect to one another has substantially vertically oriented wiper plates sealingly secured to exterior side walls of a first die and circumscribing the periphery thereof, substantially vertically oriented seal angle plates sealingly secured to exterior side walls of a second die and circumscribing the periphery thereof, with the seal angle plates extending downwardly past the parting lines of the second die and with the inward walls of the seal angle plates being substantially parallel with and closely spaced from the outward walls of the wiper plates when the mold is at least partially closed, and an elongate packing seal disposed substantially horizontally within and partially projecting from a channel on the inward wall of each seal angle plate and near the lower edge of the seal angle plate below the parting line of the second die so that the projecting portion of each packing seal presents a surface which makes sealing engagement with a wiper plate when the mold is at least partially closed, thereby defining a volume which is isolated from the surrounding atmosphere. In accordance with preferred aspects of the invention, means for preventing the packing seal from dislodging from the channel and means for adjusting the packing seal to correct for minor leaks are provided. The seal assembly of the invention has a single external peripheral seal which is effected on a vertical surface, thereby reducing leak potential and facilitating leak detection.
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