| 摘要 |
PURPOSE:To attach a cubic structure easily wettable with solder to a conductive sub-land when soldering a surface mount component attached to a printed circuit board by using flow solder. CONSTITUTION:At the rear surface 1b side of a printed wiring board 1, a plurality of terminals 13 of a surface mount component 12 are pre-positioned and pre-mounted to a plurality of copper foil lands 2; and a cubic structure 4, which is easily wetted with molten solder 22 is attached in advance to a conductive sub-land 3 which is adhered with a film to a portion near the rear side of the copper foil land 2 for soldering a rear terminal 13 in the board advancing direction of the surface mount component 12. And an excess amount of molten solder 22 adhered to the terminal 13 at the rear in the board advancing direction of the surface mount component 12 is absorbed to the cubic structure 4 when soldering the surface mount component while moving the printed wiring board 1 pre-mounted with the surface mount component 12 and a cubic structure 4 through flow solder 20 in a predetermined advancing direction of the board.
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