发明名称 CIRCUIT BOARD FOR SEMICONDUCTOR MOUNTING AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To provide a circuit board for semiconductor mounting which has a high precision conduction circuit for large-current, high-density mounting. CONSTITUTION:In a circuit board made by placing a bonded aluminium-copper foil 3 on a metallic substrate 1 through an insulating layer 2, a circuit board for semiconductor mounting wherein the thickness of the circuit formed by the bonded foil 3 is 100mum or larger, and the ratio of the circuit width to the thickness is 1 to 5. The manufacture thereof is such that when the bonded foil 3 is etched to form the circuit, of the foils making up the bonded foil 3, the foil opposite to the one contacting with the insulating layer 2 is used as a resist for the etching.</p>
申请公布号 JPH06164090(A) 申请公布日期 1994.06.10
申请号 JP19920312428 申请日期 1992.11.20
申请人 DENKI KAGAKU KOGYO KK 发明人 FUKUDA MAKOTO;YONEMURA NAOKI;WATANABE CHIHARU
分类号 H01L23/12;H05K1/05;H05K1/09;H05K3/06;H05K3/44;(IPC1-7):H05K1/09 主分类号 H01L23/12
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