摘要 |
<p>PURPOSE:To provide a circuit board for semiconductor mounting which has a high precision conduction circuit for large-current, high-density mounting. CONSTITUTION:In a circuit board made by placing a bonded aluminium-copper foil 3 on a metallic substrate 1 through an insulating layer 2, a circuit board for semiconductor mounting wherein the thickness of the circuit formed by the bonded foil 3 is 100mum or larger, and the ratio of the circuit width to the thickness is 1 to 5. The manufacture thereof is such that when the bonded foil 3 is etched to form the circuit, of the foils making up the bonded foil 3, the foil opposite to the one contacting with the insulating layer 2 is used as a resist for the etching.</p> |