| 摘要 |
PURPOSE:To enhance reliability by widening a heating temperature range at bonding by a method wherein a bare chip is placed on a high heat-proof substrate using a specific resin composition and an electrode is bonded to a pad part of a conduction layer by a gold wire. CONSTITUTION:A bear chip is placed on a substrate using a resin composition (C) described below to wire-bond it. In the resin composition (C), a resin composition (alpha) is what resin (alpha1) denoted by equation I is arranged with resin (alpha2) denoted by equation II at a weight ratio 100:0 to 30:70. Another composition is what bisphenol A(beta) denoted by equation III is arranged at a ratio of beta hydroxyl group 0.05 to 0.5 equivalents to a epoxy group tail end 1 equivalent. The resin composition (alpha) reacts on the another composition until a reaction ratio becomes 80% or more. A composition 100 pts.wt. is what the obtained resin (A) is arranged with the phenol resin (B) at a ratio of B hydroxyl group 0.7 to 1.2 equivalents to A epoxy group tail end 1 equivalent. A straightly chained high polymer phasing therein is arranged at 1 to 60 pts.wt. to obtain this embodiment. |
