| 摘要 |
PURPOSE:To effectively remove a pharmaceutical solution dropped onto a surface of a semiconductor wafer 3 and dust on the back surface of the same. CONSTITUTION:There is provided a wafer back surface cleaning nozzle 1 capable of a free radial movement. Accordingly, the entire back surface of a wafer 3 can be cleaned, and cleaning conditions can be changed depending upon the kinds and conditions of pharmaceutical solutions dropped onto the surface of the wafer 3 to keep the back surface and edges of the wafer 3 clean at all times. As a result, there are eliminated out-of-focusing caused upon projection and exposure to light and of re-adhesion of such a pharmaceutical solution to the wafer surface at later processes, so that a desired pattern can be formed and hence the yield is improved. |
