| 摘要 |
<p>PURPOSE:To obviate a frame for spacing multilayered hybrid integrated circuit boards, eliminate the heat treatment for the bonding thereof, and improve the noise shield performance. CONSTITUTION:In the peripheral portion of the surface of an insulative metallic substrate 22 in which a circuit pattern is to be formed, a step portion 28 having a width substantially equal the width of the insulative metallic substrate 22 is formed by a shearing process, and acts as a frame for spacing multilayered hybrid integrated circuit boards. The circuit pattern formed in the step portion 28 of the insulative metallic substrate 22 and the circuit pattern of a spacer sealed at a predetermined position of an insulative metallic substrate 12 are sealed by soldering, whereby the insulative metallic substrate 22 and the insulative metallic substrate 12 are fixed. Further, since the frame for spacing multilayered hybrid integrated boards is obviated and the insulative metallic substrate 22 is electrically connected to the insulative metallic substrate 12, the hybrid integrated circuit formed under the insulative metallic substrate 22 is completely shielded.</p> |
